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Thin Bondline Measurement of Adhesively Bonded Metallic Aircraft Structures using an Ultrasonic Analyzer

机译:使用超声波分析仪对粘合金属飞机结构进行薄粘合线测量

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摘要

The use of adhesive bonding for the assembly of aircraft structure is desirable because of the associated benefits of reduced weight, decreased parts count and increased fatigue life. The inability to fully characterize the nature of the bondline has been a limiting factor in applying this technology to the manufacture of primary aircraft structure. One such obstacle is the resolution limitation that has existed for the non-destructive measurement of bondline thicknesses. Up to the present time, ultrasonic methods have been limited in practice to a resolution approximately equal to the wavelength of the energy pulse employed. For a 15 MHz transducer, the highest frequency generally incorporated into off-the-shelf inspection equipment, this equates to a lower measurement limit of about 0.006″. For the FM-73 adhesive system used in this investigation, the acoustic velocity is 90, 600 inches per second [1]. The lower resolution limit will vary somewhat as a function of this speed. This limitation presented a problem because previous research had shown that the lap shear strength of aluminum bonded structure was maximized in bondlines between 0.002″ and 0.006″[2]. Furthermore, for bondlines of less than 0.002″, the lap shear strengths dropped off dramatically as illustrated in figure 1. The data presented is for elevated service temperature for an aircraft application. The trend shown is equally as valid for room temperature and at -67 degrees Fahrenheit. Clearly then, to guarantee the manufacture of a high strength, minimum weight structure while still assuring that a sufficient quantity of adhesive was present, it was necessary to establish a non-destructive inspection process, usable in production, that could quickly and accurately discern bondlines in the 0.002–0.006″ range.
机译:由于在减轻重量,减少零件数量和增加疲劳寿命方面具有相关的好处,因此希望将粘合剂用于飞机结构的组装。在将这种技术应用于飞机主要结构的制造中,无法完全表征粘结层的性质一直是一个限制因素。这样的障碍之一是对粘结层厚度的无损测量存在分辨率限制。直到目前,超声方法实际上已经被限制在大约等于所采用的能量脉冲的波长的分辨率上。对于15 MHz传感器,通常将最高频率集成到现成的检查设备中,这相当于约0.006英寸的较低测量极限。对于本研究中使用的FM-73胶粘剂系统,声速为90、600英寸每秒[1]。分辨率下限将随此速度而有所变化。该限制提出了一个问题,因为先前的研究表明,铝结合结构的搭接剪切强度在0.002英寸和0.006英寸之间的结合线中最大化[2]。此外,对于小于0.002英寸的粘结线,搭接剪切强度会急剧下降,如图1所示。给出的数据是针对飞机应用中升高的使用温度。所示趋势对于室温和-67华氏度同样有效。显然,为了保证制造出高强度,最小重量的结构,同时又确保存在足够量的粘合剂,有必要建立一种可在生产中使用的无损检测过程,以快速,准确地识别粘结层。在0.002-0.006英寸范围内。

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